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W24L01 128K x 8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24L01 is a normal-speed, very low-power CMOS static RAM organized as 131072 x 8 bits that operates on a wide voltage range from 2.7V to 3.6V power supply. The W24L01 family, W24L01-LE and W24L01-LI, can meet the requirement of various operating temperature. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* * * * * *
Low power consumption Access time: 55 nS /70 nS 2.7V to 3.6V supply voltage Fully static operation All inputs and outputs directly TTL compatible Three-state outputs
* *
Battery back-up operation capability Data retention voltage: 1.5V (min.) * Packaged in 32-pin 450 mil SOP, standard type one TSOP (8 mm x 20 mm), small type one TSOP (8 mm x 13.4 mm) and 48-pin CSP
PIN CONFIGURATIONS
NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 Vss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32-pin SOP 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD A1 5 CS2 WE A1 3 A 8 A9 A1 1 OE A10 CS 1 I/O8 I/O7 I/O6 I/O5 I/O4
BLOCK DIAGRAM
CLK GEN. A16 A14 A12 A4 A3 A2 A7 A6 A5 A9 I/O1 : I/O8 DATA CNTRL. CLK GEN. WE CS1 CS2 OE A15 A13 A8 A1A0 A11A10 I/O CKT. COLUMN DECODER D E C O D E R R O W PRECHARGE CKT.
CORE CELL ARRAY 1024 ROWS 128 X 8 COLUMNS
A11 A9 A8 A13 WE CS2 A15 VDD NC A16 A14 A12 A7 A6 A5 A4
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32-pin TSOP
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 VSS I/O3 I/O2 I/O1 A0 A1 A2 A3
PIN DESCRIPTION
SYMBOL A0 - A16 I/O1 - I/O8 DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground No Connection
48-pin CSP TOP VIEW
A B C D E F G H 1 A0 I/O5 I/O6 VSS VCC I/O7 I/O8 A9 2 A1 A2 3 CS2 WE NC 4 A3 A4 A5 5 A6 A7 6 A8 I/O1 I/O2 VCC VSS I/O3 I/O4 A14
CS , CS2
WE OE
NC OE A10 CS1 A11
NC A16 A12
A15 A13
VDD VSS NC
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Publication Release Date: January 2, 2002 Revision A6
W24L01
TRUTH TABLE
CS1 H X L L L CS2 X L H H H
OE
X X H L X
WE X X H H L
MODE Not Selected Not Selected Output Disable Read Write
I/O1-I/O8 High Z High Z High Z Data Out Data In
VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature LL Operating Temperature LE LI RATING -0.5 to +4.6 -0.5 to VDD +0.5 1.0 -65 to +150 0 to 70 -20 to 85 -40 to 85 C UNIT V V W C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VSS = 0V; TA (C) = 0 to 70 for LL, -20 to 85 for LE, -40 to 85 for LI)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output Low Voltage
SYM. VIL VIH ILI
TEST CONDITIONS MIN. VIN = VSS to VDD VI/O = VSS to VDD, CS1 = VIH (min.) or CS2 = VIL (max.) or OE = VIH (min.) or WE = VIL (max.) IOL = +2.1 mA IOH = -1.0 mA -0.2 +2.2 -1
W24L01 TYP.* MAX. +0.4 VDD +0.3 +1
UNIT
V V A
ILO VOL VOH
-1 2.2
-
+1 0.4 -
A V V
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W24L01
Operating Characteristics, continued
PARAMETER Operating Power Supply Current
SYM.
TEST CONDITIONS
CS1 = VIL (max.) and CS2 = VIH (min.) , I/O = 0 mA, Cycle = min. Duty = 100% CS1 = VIH (min.) or CS2 = VIL (max.), Cycle = min. Duty = 100% LL CS1 VDD -0.2V or CS2 0.2V LE/LI
W24L01
MIN. TYP.* 25 (3V) 30 (3.3V) MAX. 40 (70 nS) 55 (55 nS)
UNIT
IDD
mA
Standby Power Supply Current
ISB
-
-
0.3 5 7
mA
ISB1
-
2
A
Note: Typical parameter is measured under ambient temperature TA = 25 C
CAPACITANCE
(TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 2.2V 5 nS 1.5V, VDD = 3.0V See the drawing below CONDITIONS
AC Test Loads and Waveform
1 TTL OUTPUT 100 pF Including Jig and Scope OUTPUT 5 pF Including Jig and Scope (For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW ) 2.2V 0V 5 nS 90% 10% 90% 10% 5 nS 1 TTL
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Publication Release Date: January 2, 2002 Revision A6
W24L01
AC Characteristics, continued (VSS = 0V; TA (C) = 0 to 70 for LL, -20 to 85 for LE, -40 to 85 for LI)
Read Cycle
PARAMETER Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change
These parameters are sampled but not 100% tested
SYM. TRC TAA TACS TAOE TCLZ* TOLZ* TCHZ* TOHZ* TOH
MIN. 55 10 5 5
MAX. 55 55 30 25 25 -
MIN. 70 10 5 10
MAX. 70 70 35 30 30 -
UNIT nS nS nS nS nS nS nS nS nS
Write Cycle
PARAMETER Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write
These parameters are sampled but not 100% tested
SYM. TWC TCW TAW TAS TWP
MIN. 55 50 50 0 40 0 30 0 5
MAX. 20 20 -
MIN. 70 60 60 0 55 0 30 0 5
MAX. 25 25 -
UNIT nS nS nS nS nS nS nS nS nS nS nS
CS1, CS2, WE
TWR TDW TDH TWHZ* TOHZ* TOW
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W24L01
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC Address TOH DOUT TAA TOH
Read Cycle 2
(Chip Select Controlled)
CS1
CS2 TACS TCLZ DOUT TCHZ
Read Cycle 3
(Output Enable Controlled)
T RC Address TAA OE TAOE TOLZ CS1 TOH
CS2
TACS DOUT TCLZ
T CHZ
TOHZ
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Publication Release Date: January 2, 2002 Revision A6
W24L01
Timing Waveforms, continued
Write Cycle 1
TWC Address T WR OE
TCW CS1
CS2 TAW WE TAS TOHZ D OUT T DW D IN TDH (1, 4) T WP
Write Cycle 2
(OE = VIL Fixed)
TWC Address TCW CS1 TWR
CS2 TAW WE TAS TWP TWHZ (1, 4) TOH (2) TOW (3)
D OUT
TDW DIN
TDH
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
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W24L01
DATA RETENTION CHARACTERISTICS
(TA (C) = 0 to 70 for LL, -20 to 85 for LE; -40 to 85 for LI)
PARAMETER VDD for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time * Read Cycle Time
SYM. VDR IDDDR TCDR TR
TEST CONDITIONS CS1 VDD -0.2V or CS2 0.2V CS1 VDD -0.2V or CS2 0.2V, VDD = 3V See data retention waveform
MIN. 1.5 0 TRC*
TYP. -
MAX. UNIT 5 V A nS nS
DATA RETENTION WAVEFORM
VDD
0.9 x V DD TCDR
> VDR = 1.5V
0.9 x V DD TR
CS1
CS1 > V DD - 0.2V =
CS2
0V < CS2 < 0.2V = = V
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Publication Release Date: January 2, 2002 Revision A6
W24L01
ORDERING INFORMATION
PART NO. W24L01B-55LL W24L01Q-55LL W24L01S-55LL W24L01T-55LL W24L01B-55LE W24L01Q-55LE W24L01S-55LE W24L01T-55LE W24L01B-55LI W24L01Q-55LI W24L01S-55LI W24L01T-55LI W24L01B-70LL W24L01Q-70LL W24L01S-70LL W24L01T-70LL W24L01B-70LE W24L01Q-70LE W24L01S-70LE W24L01T-70LE W24L01B-70LI W24L01Q-70LI W24L01S-70LI W24L01T-70LI
Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
ACCESS TIME (nS) 55 55 55 55 55 55 55 55 55 55 55 55 70 70 70 70 70 70 70 70 70 70 70 70
OPERATING VOLTAGE (V) 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V 2.7V - 3.6V
OPERATING TEMPERATURE (C) 0 to 70 0 to 70 0 to 70 0 to 70 -20 to 85 -20 to 85 -20 to 85 -20 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70 0 to 70 0 to 70 0 to 70 -20 to 85 -20 to 85 -20 to 85 -20 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 CSP
PACKAGE
Small type one TSOP 450 mil SOP Standard type one TSOP CSP Small type one TSOP 450 mil SOP Standard type one TSOP CSP Small type one TSOP 450 mil SOP Standard type one TSOP CSP Small type one TSOP 450 mil SOP Standard type one TSOP CSP Small type one TSOP 450 mil SOP Standard type one TSOP CSP Small type one TSOP 450 mil SOP Standard type one TSOP
-8-
W24L01
PACKAGE DIMENSIONS
32-pin Small Type One TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max. 0.049 0.002
Dimension in mm Min. Nom. Max. 1.25 0.15 1.00 0.20 0.15 1.05 0.27 0.16
D c
1
A A1 A2 b c D E HD e L L1
0.006 0.05 0.95 0.17
e
E
0.037 0.039 0.041 0.007 0.008 0.009
0.0056 0.0059 0.0062 0.14 0.461
b
0.465 0.469 11.70 11.80 11.90 7.90 8.00 8.10
0.311 0.315 0.319
0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.012 0.020 0.028 0.027 0.000 0 3 0.004 5 0.30 0.675 0.00 0 3 0.10 5 0.50 0.50 0.70
A A
2
L L1
A1
Y
Y
Controlling dimension: Millimeters
32-pin SOP Wide Body
Dimension in Inches Dimension in mm
Symbol
17
Min.
0.004 0.101 0.014 0.006
Nom.
Max.
0.118
Min. Nom.
0.10
Max.
3.00
32
e1
E HE
L
Detail F
1 16
b
A A1 A2 b c D E e HE L LE S y
0.106 0.016 0.008 0.805
0.111 0.020 0.012 0.817 0.450 0.056 0.556 0.039 0.063 0.036 0.004
2.57 0.36 0.15
2.69 0.41 0.20 20.45
2.82 0.51 0.31 20.75 11.43 1.42 14.38 0.99 1.60 0.91 0.10
0.440 0.044 0.546 0.023 0.047
0.445 0.050 0.556 0.031 0.055
11.18 1.12 13.87 0.58 1.19
11.30 1.27 14.12 0.79 1.40
Notes:
D e1 c A2 S y e A1 LE A
0
10
0
10
1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec should be based on final visual inspection spec.
See Detail F
Seating Plane
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Publication Release Date: January 2, 2002 Revision A6
W24L01
Package Dimensions, continued
32-pin Standard Type One TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max.
0.047 0.006 0.041 0.009 0.007
Dimension in mm Min. Nom. Max.
1.20 0.15 1.05 0.23 0.17 18.50 8.10 20.20
D c
1
A A1 A2 b
__
0.002 0.037 0.007
__ __
0.039 0.008
__
0.05 0.95 0.17 0.12
__ __
1.00 0.20 0.15
M
e E
c D E HD e L L1
0.005 0.006 0.720 0.311 0.780 0.724 0.315 0.787 0.020 0.020 0.031
0.10(0.004)
0.728 18.30 18.40 0.319 7.90 8.00 20.00 0.50 0.50 0.80
b
0.795 19.80
__
0.016
__
0.024
__
0.40
__
0.60
__
0.000 1
__
0.004 5
__
0.00 1
__
0.10 5
A A2 L L1 A1
Y Y
__
3
__
3
Controlling dimension: Millimeters
- 10 -
W24L01
VERSION HISTORY
VERSION A1 A2 A3 A4 A5 A6 DATE Feb. 1998 Apr. 1998 June 1998 Oct. 1998 Jan. 1999 Jan. 2, 2002 Initial Issued Add standby power supply current (ISB1) typical parameter when operation temperature TA = 25 C Change supply voltage range from (2.7V to 3.6V) to (2.3V to 3.3V) Add SOP package type Add SOP package pin configuration Change supply voltage range from (2.3V - 3.3V) to (2.7V - 3.6V). Add 55 nS spec. Add LL grade. DESCRIPTION
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East. Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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Publication Release Date: January 2, 2002 Revision A6

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